Wafer back grinding wheels
LED epitaxial wafer thinning grinding wheel
Application areas and scope of application:
Mainly used in LED industry sapphire epitaxial wafer back thinning processing
can be processed 2 inches, 4inches, 6inches epitaxial wafer.
Features:
1.High grinding efficiency.
2.The quality of grinding wheel is stable, and it is not easy to scrape and fragment deeply.
3.The grinding wheel has long life and high cost performance,and can greatly reduce the processing cost of a single chip.
SAUNDERS
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Phone:+8618737176818
Skype:zhengzhouhongtuo
E-mail: cathy@hongtuocy.com
Address:NO.135,Longfei nan Street,International Logistics Park,
Economic Development Zone,Zhengzhou,China.
TAT GROUP Co.
Tehran, IRAN
www.tat-tool.com
Sales Manager:
Mr. Sadegh Hafezi Zadeh
Cell: +98 912 297 9217
Email: sales@tat-tool.com
LLC “Perspectiva”
Address:N12/1 office, 6, Slavyansky Ave., Ryazan, Ryazan region, Russia, 390035
Tel: 007 4912 77-68-82
E-mail: info@prspk.ru
www.prspk.ru
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