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Wafer back grinding wheels
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Wafer back grinding wheels

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LED epitaxial wafer thinning grinding wheel

Application areas and scope of application:
Mainly used in LED industry sapphire epitaxial wafer back thinning processing
can be processed 2 inches, 4inches, 6inches epitaxial wafer.

Features:
1.High grinding efficiency.
2.The quality of grinding wheel is stable, and it is not easy to scrape and fragment deeply. 
3.The grinding wheel has long life and high cost performance,and can greatly reduce the processing cost of a single chip.

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Phone:+8618737176818
Skype:zhengzhouhongtuo
E-mail: cathy@hongtuocy.com
Address:NO.135,Longfei nan Street,International Logistics Park,
Economic Development Zone,Zhengzhou,China.

 

TAT GROUP Co.

Tehran, IRAN

www.tat-tool.com

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Mr. Sadegh Hafezi Zadeh
Cell: +98 912 297 9217
Email: sales@tat-tool.com

 

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TAT GROUP Co.
Tehran, IRAN


Tel: +98 (21) 22219118
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