Dicing blades industry

　　Dicing blades that Hongtuo manufactures can be used within the photoelectric industry for manufacturing hard, brittle and delicate materials such as semi-conductor silicon wafers, solar silicon wafers, PCD, diamond tools, CBN, cemented carbide, structural ceramics and quartz.

　　To improve the product quality of these diamond dicing blades and cutting wheels, we brought in advanced electroplating production equipment and technology from the German Trenker Company in 2009. This is primarily used to produce ultra-thin cutting discs in a thickness of 0.02-0.08mm and is used for dicing silicon wafers and circuit boards within the electronic industry.