Our porous ceramic and metal chuck table is a specially designed tool for water absorption and holding purposed during the production of semiconductor wafers. It is mainly used in back grinding and dicing processes. The back grinding chuck tables and dicing chuck tables work well with Japanese, German and Chinese dicing saws and back grinding machines, thus ensuring an excellent cost effectiveness.

As a major dicing blade supplier, Hongtuo offers a wide range of bonded dicing blades, and an equally wide range of blade dressing boards used in different applications. The blade dressing board is made from premium resin and multiple abrasives using a sintering process. It has become an indispensable dicing accessory used in the sharpening and dressing of dicing blades.

Hongtuo’s HT-RB series resin bond diamond blades are some of the most advanced in diamond grinding technology. They apply a thermosetting resin bond material and inter it with diamond abrasives. This diamond grinding tool features an outstanding flexibility and can greatly improve cutting efficiency.It has become a preferred super abrasive tool for cutting hard, brittle and delicate materials, such as glass and crystalline materials.

The HT-RM series metal sintered blade – also called a metal bond blade—is one of our most wear resistant and enduring dicing blades. This diamond tool is sintered from a combination of diamond powders and metal bonds. It comes with excellent form holding characteristics, and an extremely high wear resistance, making it ideal for cutting and slotting of electronic and optical components.