Silicon Wafer Back Grinding Wheels
Silicon Wafer Back Grinding Wheels
Application areas and scope of application:
It is mainly used for thinning and fine grinding of semiconductor wafers
Features:
1. Excellent grinding performance and high cost performance.
2. lt can be stably used in grinding machines made in Europe, America,Japan and China, and can replace imported products.
SAUNDERS
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Contact us
Phone:+8618737176818
Skype:zhengzhouhongtuo
E-mail: cathy@hongtuocy.com
Address:NO.135,Longfei nan Street,International Logistics Park,
Economic Development Zone,Zhengzhou,China.
TAT GROUP Co.
Tehran, IRAN
www.tat-tool.com
Sales Manager:
Mr. Sadegh Hafezi Zadeh
Cell: +98 912 297 9217
Email: sales@tat-tool.com
LLC “Perspectiva”
Address:N12/1 office, 6, Slavyansky Ave., Ryazan, Ryazan region, Russia, 390035
Tel: 007 4912 77-68-82
E-mail: info@prspk.ru
www.prspk.ru
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