Chuck Table
Our porous ceramic and metal chuck table is a specially designed tool for water absorption and holding purposed during the production of semiconductor wafers. It is mainly used in back grinding and dicing processes. The back grinding chuck tables and dicing chuck tables work well with Japanese, German and Chinese dicing saws and back grinding machines, thus ensuring an excellent cost effectiveness.
Features
1. Thiswafer chuck provides a high flatness and depth of parallelism.
2. It is compact in structure, uniform size and high strength.
3. It features a well-distributed absorption capacity.
4. Thedicing accessory is easy to dress.
Applications
2, 3, 4, 5, 6, 8 and 12 inch semiconductor wafers
Applicable Machines
Back grinding machines, dicing saws
Contact us
Phone:+86-371-62266855
Skype:zhengzhouhongtuo
E-mail: cathy@hongtuocy.com
Address:NO.135,Longfei nan Street,International Logistics Park,
Economic Development Zone,Zhengzhou,China.
Mobile code
Micro-code
Copyright © 2017 Zhengzhou Hongtuo Precision Tools Co., Ltd. All Rights Reserved 豫ICP备11016813号 Powered by www.300.cn