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Dicing blades industry

Dicing blades industry

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  • Time of issue:2019-11-21 00:00:00
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  Dicing blades that Hongtuo manufactures can be used within the photoelectric industry for manufacturing hard, brittle and delicate materials such as semi-conductor silicon wafers, solar silicon wafers, PCD, diamond tools, CBN, cemented carbide, structural ceramics and quartz.

  To improve the product quality of these diamond dicing blades and cutting wheels, we brought in advanced electroplating production equipment and technology from the German Trenker Company in 2009. This is primarily used to produce ultra-thin cutting discs in a thickness of 0.02-0.08mm and is used for dicing silicon wafers and circuit boards within the electronic industry.

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Contact us

 

Phone:+8618737176818
Skype:zhengzhouhongtuo
E-mail: cathy@hongtuocy.com
Address:NO.135,Longfei nan Street,International Logistics Park,
Economic Development Zone,Zhengzhou,China.

 

TAT GROUP Co.

Tehran, IRAN

www.tat-tool.com

Sales Manager:
Mr. Sadegh Hafezi Zadeh
Cell: +98 912 297 9217
Email: sales@tat-tool.com

 

LLC “Perspectiva”


Address:N12/1 office, 6, Slavyansky Ave., Ryazan, Ryazan region, Russia, 390035
Tel: 007 4912 77-68-82
E-mail: info@prspk.ru  

www.prspk.ru

hongtuo

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TAT GROUP Co.
Tehran, IRAN


Tel: +98 (21) 22219118
E-mail: zzhtcy@gmail.com

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