Porous Ceramic Chuck Table
Our porous ceramic and metal chuck table is a specially designed tool for water absorption and holding purposed during the production of semiconductor wafers. It is mainly used in back grinding and dicing processes. The back grinding chuck tables and dicing chuck tables work well with Japanese, German and Chinese dicing saws and back grinding machines, thus ensuring an excellent cost effectiveness.
Features
1. Thiswafer chuck provides a high flatness and depth of parallelism.
2. It is compact in structure, uniform size and high strength.
3. It features a well-distributed absorption capacity.
4. Thedicing accessory is easy to dress.
Applications
2, 3, 4, 5, 6, 8 and 12 inch semiconductor wafers
Applicable Machines
Back grinding machines, dicing saws
SAUNDERS
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Contact us
Phone:+8618737176818
Skype:zhengzhouhongtuo
E-mail: cathy@hongtuocy.com
Address:NO.135,Longfei nan Street,International Logistics Park,
Economic Development Zone,Zhengzhou,China.
TAT GROUP Co.
Tehran, IRAN
www.tat-tool.com
Sales Manager:
Mr. Sadegh Hafezi Zadeh
Cell: +98 912 297 9217
Email: sales@tat-tool.com
LLC “Perspectiva”
Address:N12/1 office, 6, Slavyansky Ave., Ryazan, Ryazan region, Russia, 390035
Tel: 007 4912 77-68-82
E-mail: info@prspk.ru
www.prspk.ru
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